发明名称 |
Antenna having elements with improved thermal impedance |
摘要 |
A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active device have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.
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申请公布号 |
US5717231(A) |
申请公布日期 |
1998.02.10 |
申请号 |
US19960680892 |
申请日期 |
1996.07.16 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
TSERNG, HUA QUEN;SAUNIER, PAUL;SANZGIRI, SHASHIKANT M. |
分类号 |
H01L27/04;H01L21/822;H01L21/8222;H01L23/367;H01L23/482;H01L23/538;H01L23/66;H01L27/06;(IPC1-7):H01L29/41;H01Q13/08;H01Q23/00 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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