发明名称 Antenna having elements with improved thermal impedance
摘要 A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active device have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.
申请公布号 US5717231(A) 申请公布日期 1998.02.10
申请号 US19960680892 申请日期 1996.07.16
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 TSERNG, HUA QUEN;SAUNIER, PAUL;SANZGIRI, SHASHIKANT M.
分类号 H01L27/04;H01L21/822;H01L21/8222;H01L23/367;H01L23/482;H01L23/538;H01L23/66;H01L27/06;(IPC1-7):H01L29/41;H01Q13/08;H01Q23/00 主分类号 H01L27/04
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