摘要 |
<p>PROBLEM TO BE SOLVED: To avoid the influence of environmental humidity and prevent the conductive filler from falling off and dust from adhering thereon and thus improve heat sealing thereof by exposing a part of the surface of a conductive filler within the conductive heat sealing layer containing heat sealing resin, and allowing other parts thereof to be buried within the heat sealing layer. SOLUTION: On a separative foundation sheet 1 with fine unevennesses formed on the surface, a heat sealing resin layer 2a containing a conductive filler is provided by a coating method as a conductive heat sealing layer 2. Namely, the conductive sealing layer 2 is formed by applying and drying once a heat sealing resin 2a solution containing a conductive filler on the separative foundation sheet 1, and then laminating this on the foundation film surface through transfer. In this manner, the surface of the conductive heat sealing layer 2 is formed in such a configuration that the surface of the separative base sheet 1 is transferred with the conductive filler not exposed on the surface but the surface exposed; however, other parts buried in the heat sealing resin.</p> |