发明名称 |
Demetallization of polymer/metal multilayer films by etching |
摘要 |
A method of improving the breakdown strength of polymer multi-layer (PML) capacitors is provided. The method comprises removing metal, specifically, aluminum, from the cut edge. This is done by either etching back the metal electrode layers in either basic or acidic solution or by anodizing the metal to cover that portion of the metal at the edge with an oxide. Removing the metal from the cut edge increases the breakdown strength of the PML capacitors by a factor of two or more.
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申请公布号 |
US5716532(A) |
申请公布日期 |
1998.02.10 |
申请号 |
US19960661387 |
申请日期 |
1996.06.11 |
申请人 |
SIGMA LABS, INC.;MEDTRONIC INC |
发明人 |
YIALIZIS, ANGELO;KEIMEL, JOHN G.;RHORER, ALVIN S.;HUNTOON, TREY W. |
分类号 |
H01G4/012;H01G4/30;H01G13/06;(IPC1-7):H01G4/228;B21F41/00 |
主分类号 |
H01G4/012 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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