发明名称 Polishing apparatus
摘要 A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.
申请公布号 US5716264(A) 申请公布日期 1998.02.10
申请号 US19960683424 申请日期 1996.07.18
申请人 EBARA CORPORATION 发明人 KIMURA, NORIO;KIKUTA, RITSUO;ISHII, YOU;HIROSE, MASAYOSHI
分类号 B24B37/00;B24B37/04;B24B53/007;(IPC1-7):B24B21/18 主分类号 B24B37/00
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