Parts disassembling apparatus

摘要

A printed wiring board, on which an electronic parts are mounted and fixed by way soldering, is introduced into a heating furnace for heating at a temperature higher than or equal to a melting temperature of a solder. After sufficiently melting of solder, an impact force and/or a shearing force are applied. By this under a reduced connecting force, the electronic parts are removed from a printed wiring board. On the other hand, since the parts can be easily removed from the printed wiring board. Also, the parts and the printed circuit are separated for collecting useful substance and can improve resistance to enhance recycling efficiency.