| 摘要 |
A method for removing harmful substances of an exhaust gas discharged from a semiconductor manufacturing process. The method includes the steps of: removing at least one of a water-soluble component, a hydrolyzable component and dust contained in the exhaust gas discharged from semiconductor manufacturing equipment by water scrubbing; heating the water-scrubbed exhaust gas to thermally decompose a thermally-decomposable component contained therein and removing dust generated by the thermal decomposition from the thermally-decomposed exhaust gas by water scrubbing to render the thermally decomposed exhaust gas into a clean exhaust gas.
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