发明名称 Packaging for semiconductor chip
摘要 The packaging (30) has a lower part with an upper side fastened to a chip (31). The packaging also has an upper part which makes a transition into a circumferential region of the upper side and which has several edge surfaces. These edges, together with a central region of the upper side, define a cavity (30f) to receive the chip. The edge surfaces form four corners which respectively correspond to the four corners of the chip. Several electrical conductors (30ea-30ed) are formed on an upper surface of the upper part around the cavity. These are connected to contact pads on an upper side of the chip by electrically conducting wires (30f). A number of pins (30g) are connected with several electrical conductors. At least one notch (30j) is formed in the upper part to cooperate with the four corners of the cavity so that one of the four corners of the chip can extend into the notch.
申请公布号 DE19733416(A1) 申请公布日期 1998.02.05
申请号 DE1997133416 申请日期 1997.08.01
申请人 NEC CORP., TOKIO/TOKYO, JP 发明人 UJIIE, MASATO, TOKIO/TOKYO, JP;OMORI, EIJI, TOKIO/TOKYO, JP
分类号 B65D85/86;H01L21/52;H01L23/057;H01L23/13 主分类号 B65D85/86
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