| 摘要 |
PROBLEM TO BE SOLVED: To form an IC card capable of preventing confidential data from being lost by trouble by employing a formation of extremely decreasing the rate of bending stress applied on an IC module relative to one applied on an IC card. SOLUTION: An IC card is formed that a gradually stepped recess part 19 is formed by cutting operation or the like with a first recess part 16 at a predetermined position of a card foundation material 15 and a second recess part 17 in the vicinity of the central part thereof, and an IC module is fitted in the recess part 19 to be fixed adhesively, and in order to prevent damage of IC chips and breakage of bonding wires due to bending stress applied on the IC card, a stiffener board 12 is set at the rear surface side and around a resin mold part 27 of an IC substrate 26 of the IC module 10, and fitted in the recess part 19 of the card foundation material 15 via the adhesive film 11. |
