| 摘要 |
PROBLEM TO BE SOLVED: To realize an electronic component mounting equipment which is capable of carrying out a mounting operation at a high speed by a method in which the mounting equipment is equipped with two mounting heads provided with many suction nozzles each, the mounting heads are arranged on the same line sandwiching a table which holds a printed board between them, and one of the mounting heads carries out a suction operation while the other carries out a mounting operation. SOLUTION: A first mounting head 10 is moved towards a first line sensor 12, it is detected by the sensor 12 whether the suction nozzles of the mounting head 10 pick up electronic components or not, and the height of an electronic component is stored for each nozzle. At this point, a second mounting head 11 mounts electronic components picked up by its nozzles at a second part feed station 3 on a printed board placed on a table 6. The first mounting head 10 is moved to a mounting position to mount electronic components on a printed board placed on the table 6 at the same time when the second mounting head 11 finishes its mounting operation. At this point, the second mounting head 11 is moved to a certain position indicated by the program of the second feed station 3 to pick up electronic components and then transferred to a second line sensor 13. This procedure is repeatedly carried out for mounting electronic components on a printed board, so that an electronic component mounting equipment of this constitution is capable of carrying out a mounting operation at a higher speed. |
