| 摘要 |
PROBLEM TO BE SOLVED: To make the distribution of a grinding pressure uniform so as to keep a grinding margin constant and to perform grinding of a high degree of flatness by performing grinding while applying, in the backside region of a plate, a pressing force only to a region for holding a thin plate immediately below when grinding is to be performed by holding and sliding the thin plate in contact with a grinding means. SOLUTION: For grinding a wafer 1 by a grinding device, the wafer 1 is stuck to the wafer holding surface of a plate 2 and placed on the upper surface of grinding cloth on a level block, then a head 6 is lowered and the inside of a diaphragm 10 is pressurized by an air pressure. Then, while rotating the level block and the head 6 relative to each other, the wafer 1 is slid in contact and ground. Thus, since forces between the upper and lower surfaces of the plate 2 are balanced, no deformation occurs in the plate 2 and accordingly the plate 2 manufactured flat keeps its flatness even during grinding work. Thus, the distribution of a grinding pressure on the surface of the wafer 1 is made uniform and also a grinding margin is kept constant. |
