| 摘要 |
PROBLEM TO BE SOLVED: To accurately control and uniformly apply polishing pressure to the whole inner surface region of a semiconductive wafer, and maintain the semiconductive wafer and an abrasive body in high parallel. SOLUTION: A wafer retaining board 52 is loosely inserted into a supporting frame body 46, and oscillation freely and movably in a vertical and horizontal directions to an abrasive cloth 16, and an air chamber 22 is formed between the wafer retaining board 52 and the supporting frame body 46. Consequently, force applied to the wafer supporting board 52, that is, polishing pressure can be controlled by controlling the inner pressure of the air chamber 22. Since uniform pressurization can be made in the whole upper surface region of the wafer retaining board 52, the uniform polishing pressure can be applied to the whole inner surface region of a semiconductive wafer 12. Moreover, the semiconductive wafer 12 and an abrasive cloth 16 can be maintained in parallel, because the wafer retaining board 52 is tilted following the possible variation of the tilt of the abrasive cloth 16. |
