| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board, which is constituted so as to be able to provide a modified wiring on the board after a bare chip is mounted on the board without imparing the quality after mounting of the bare chip and the productivity of the printed-wiring board. SOLUTION: This printed wiring board 1 is constituted into a structure, wherein a bare chip is mounted on the board in a face down manner and at the same time, wiring patterns 3, which correspond to bump electrodes of the bare chip and are extendedly provided from the above mounted region of the bare chip, are formed. In this case, with the surfaces of the above wiring patterns 3 separated from each other by insulating material layers 4a, 4b, 4c and 4d, the surfaces on one side of the separated surfaces of the patterns 3 are used as bare chip mounting pads 2, which are connected with the bump electrodes of the bare chip, and at the same time, the other separated surfaces of the patterns 3 are used as modified wiring pads 6 and 7, which are connected with an external connection conductor. |
