发明名称 MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To realize a molding die, which is easily assembled and disassembled and has no liquid leakage or the like, by a method wherein space parts, each portion thereof in contact with at least either one of a top surface plate and a bottom surface plate of which is opened, are formed in a spacer so as to closely join the opposing surface plates to the spacer by vacuumizing the space parts at the assembling of a molding die. SOLUTION: Space parts 4 are preferably arranged evenly over the whole periphery of a spacer 3. Thus, the whole periphery of the spacer 3 easily joins closely and evenly to surface plates 1 and 2. Further, through a slightly complicated structure results, preferably the space parts are communicated with one another. By vacuumizing the space parts 4 through connecting mechanisms 6 at the state of the temporary assembling of a molding die, the spacer 3 and the surface plates 1 and 2 can be joined closely. In addition, by introducing air through the connecting mechanisms 6 in the space parts, the joining between the spacer 3 and the surface plates 1 and 2 can easily be released.
申请公布号 JPH1029218(A) 申请公布日期 1998.02.03
申请号 JP19960187795 申请日期 1996.07.17
申请人 MITSUBISHI CHEM CORP 发明人 KUBOTA TETSUYA;SAKAI AKIHIKO
分类号 B29C33/48;B29C39/02;B29C39/26;B29C39/42;B29K101/10;B29L7/00;(IPC1-7):B29C39/26 主分类号 B29C33/48
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