| 摘要 |
PROBLEM TO BE SOLVED: To reduce pollution of wafer by preventing the persistence of a pollutant in a processing vessel of a wet processor. SOLUTION: In a processing vessel 42 wet processing a wafer carrier tub 45 containing a plurality of wafers 40, curved surfaces are formed on the cornier of corner member, formed on the peripheral wall in the vessel as well as the cornet, wherein the peripheral wall and the bottom come into contact with each other; outer walls 44-1 encircling the periphery of this processing vessel 41 is provided; a discharging trench 44 is formed between this outer wall 44-1 and the processing vessel 41; curved surfaces are formed on the corner of the peripheral wall corner member in this discharging trench 44 as well as on the corner, wherein the peripheral wall and the bottom come into contact; while a feeding line 42 of processing solution and discharging line 43 are respectively provided on the bottom of the processing vessel 41 and the bottom of the discharging trench 44, and furthermore, the other curved surfaces are formed on the bent parts of the lines 42, 43 so as to prevent the generation or persistence of the pollutant.
|
