Process for producing a silica sintered product for a multi-layer wiring substrate

摘要

A process for producing a silica sintered product for a multi-layer wiring substrate of the invention includes: providing a fine silica powder having an average particle size of 5 to 500 nm and a fine crystallized quartz powder having an average particle size 1 to 10 mu m, the fine crystallized quartz powder having a volume equal to 1 to 20% of the entire volume of the fine silica powder and the fine crystallized quartz powder; mixing the fine silica powder and the fine crystallized quartz powder with a binder and a solvent to form a silica-containing slurry; forming a green sheet by slip-casting the silica-containing slurry; and firing the green sheet at a temperature of 800 DEG to 1200 DEG C. in an atmosphere containing steam at a partial pressure of 0.005 to 0.85 atm.