| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solderable conductive paste which maintains such fundamental traits as oxidation resistance, anti-migration property, bonding strength, printing performance, and anti-sedimenting property, wherein particularly the solderability is enhanced to the same degree as a copper foil. SOLUTION: A copper alloy powder expressed by Agx Cuy is used, having a region whose silver concentration of the facial part of each particle is higher than the mean silver concentration of particles, where such condition should be met that 0.001<=x<=0.4, 0.6<=y<=0.999, and x+y=1 by atomic ratio. From this powder a conductive paste is formed, which contains 100 parts by wt. copper alloy powder having mean particle size between 5-35μm, one or more sorts of resin binder, a solvent, and 0.001-10 parts by wt. higher aliphatic acid and/or higher aliphatic ester to be added as a solderability improving agent. A coating film is formed with this conductive paste.</p> |
