Semiconductor devices having protruding contacts and method for making the same

摘要

The present invention is directed to a semiconductor device comprising : a first semiconductor device (31) having a first protruding contact (37) ; and at least one of a circuit board and a second semiconductor device (31) having a second protruding contact (37) whose hardness is lower than the hardness of said first protruding contact (37), wherein at least a part of said first protruding contact (37) is embedded in said second protruding contact (37). The semiconductor device further comprises an electrically insulating resin (39) disposed between said first semiconductor device and said circuit board or second semiconductor device (31).