| 摘要 |
PURPOSE:To remove problems such as corrosion by a simple construction having a semiconductor base, a light-emitting part and a light-transmitting resin coat formed on an electrode of the light-emitting part. CONSTITUTION:An LED array chip has a construction wherein a light-emitting part 32 is formed in a semiconductor base 31 constituted of GaAsP and an insulating film 33 constituted of SiO2, Al2O3, Si3N4 or the like is formed in a part except the light-emitting part 32, on the semiconductor base 31. The light-emitting part 32 is connected with a light-emitting part electrode 34 provided on the insulating film 33, and a silicone resin coat film 35 is formed on the light-emitting part 32, the insulating film 33 and the light-emitting part electrode 34. This resin coat can be applied also to a terminal part of the light- emitting electrode to which a bonding wire is connected, and the whole area of the surface of the LED chip can be coated therewith. Accordingly, without providing a construction wherein a protecting cover is provided and a gas is enclosed, as is the usual case of covering with a passivation film, the corrosion or oxidation of the terminal part of the light-emitting part electrode can be prevented and also the construction can be simplified. |
