| 摘要 |
PROBLEM TO BE SOLVED: To enable a coating film to vary less in thickness throughout the surface of a wafer by a method wherein the surface of the wafer is subjected to a process so as to be coated with a film which is not wetted by the solvent of a coating solution, and then a coating film is formed on the surface of the wafer by spin coating. SOLUTION: A wafer 110 is subjected to a cleaning treatment, and then a treatment which enables a region not to be wetted by the solvent of a coating solution is performed onto a required region of the wafer 110 where a coating solution is applied. This treatment is carried out in such a manner that a member impregnated with processing solution is pressed against the wafer 110 so as to form a coating film 120 which is not wetted by the solvent of a coating solution on the periphery of prescribed width of the wafer and marks on the wafer 110. The coating film 120 is made of, for instance, organosiloxane. An organosiloxane film is formed on a wafer in such a method that organosiloxane dissolved into isopropyl alcohol is applied and then dried out by evaporating isopropyl alcohol by heating. Then, the wafer 110 is set on a rotator 130 of a rotating device, and a coating solution is made to drip down on the wafer 110 which is rotated, whereby a coating solution is applied onto the wafer 110 by spin-coating. |
