摘要 |
PROBLEM TO BE SOLVED: To obtain a rinsing soln. compsn. not corroding the metallic thin film of a substrate by using a water-soluble org. solvent and water. SOLUTION: This rinsing soln. compsn. used for rinsing a substrate for production of a semiconductor device or a liq. crystal panel device subjected to peeling treatment with a hydrofluoride-contg. peeling soln. contains 20-90wt.%, preferably 40-80wt.% water-soluble org. solvent and 10-80wt.%, preferably 20-60wt.% water. The org. solvent is preferably at least one selected from among alcohol, glycol monoether and an aprotic polar solvent. It is especially preferably monohydric alcohol such as methanol, ethanol or isopropanol. |