发明名称 FLEXIBLE CIRCUIT BOARD STRUCTURE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To reduce a time, when is accompanied by an exchange of sprocket rollers, in the case where different standards of sprocket holes are handled in the manufacture of a flexible circuit board with a pattern formed on a film formed using a resin as its base material. SOLUTION: Two kinds of a wide sprocket hole standard and a superwide sprocket hole standard of wide sprocket holes and superwide sprocket holes are both punched in the same film. In this case, the superwide sprocket hole standard of the superwide sprocket holes 3 obtainable by punching 1.42 mm-square of holes are punched between the wide sprocket hole standard of the wide sprocket holes 2 obtainable by punching 1.981mm-square of holes at intervals of 4.75mm in the polyimide resin film 1 of a thickness of 50 to 125μm. When the holes 2 and 3 are formed in such a way, the holes 2 do never overlap the holes 3 because the intervals between the wide sprocket hole standard of the holes 2 and the intervals between the superwide sprocket hole standard of the holes 3 are the same intervals of 4.75mm.
申请公布号 JPH1027828(A) 申请公布日期 1998.01.27
申请号 JP19960182529 申请日期 1996.07.11
申请人 SEIKO EPSON CORP 发明人 TAKAHASHI HIROMASA
分类号 H01L21/60;H05K1/00;H05K3/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址