| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to detect the bonding load of a material to be bonded with high accuracy and easily. SOLUTION: In the case where a wire bonding device 10 is constituted into such a structure that a material to be bonded is bonded by pressing on a bonding material using a capillary 17, a plate spring 22, which is installed in the movable extent of the capillary 17 and is previously measured the load- displacement characteristics, is provided. There, the bonding load, which is imparted by the capillary 17, of this plate spring 22 is found in such a way that it is detected on the basis of the load-displacement characteristics from a displacement at the time when the spring 22 is made to displace by the above bonding load. |
