| 摘要 |
PROBLEM TO BE SOLVED: To repair an MCM without giving an unnecessary heat history to chips by a method wherein an adverse effect is prevented from being given to the other chips by defective chips. SOLUTION: First, an inspection of the electrical characteristics of a module fabricated to a wire bonding process, is made and a defective chip is detected. Then, bonding wires connecting the defective chip with a substrate are removed by tweezers. If the wires are left, short-circuit between the defective chip and the substrate may occur. After that, a bonding agent is applied to the defective chip, and a non-defective chip is bonded to the defective chip. Lastly, by performing wire bonding of the non-defective chip, the repair of the multi-chip module(MCM) ends. However, in the case where the defective chip is not the uppermost chip of a three-dimensional stack formed by stacking chips in the repair of the MCM mounted with the stack, an insulative bonding agent, such as an epoxy resin, is used. Thereby, the repair of the MCM can be made possible without giving an unnecessary heat history to the chips. |
