Heat exchanger manifold having a solder strip

摘要

A method for making a manifold for a tube and fin type heat exchanger is disclosed wherein the manifold includes a solder strip. The manifold includes a channel having a base member and a pair of vertical walls, a plurality of fluid conducting passageways in the base member, and a solder strip disposed in the channel. The strip is secured in place by bending a portion of the wall over a longitudinal edge of the solder strip.