| 摘要 |
PROBLEM TO BE SOLVED: To suppress occurrence of deformation such as warp or twist even when used in high-temperature environment by forming a ceramic layer between an insulating layer and a conductive layer constructing a substrate. SOLUTION: A high-temperature double-sided substrate 1 is formed by providing a ceramic layer 5 between an upper first conductive layer 2 and an insulating layer 3, and between a lower second conductive layer 4 and the insulating layer 3. By using the ceramic material for the printed board, the expansion ratio of the entire substrate is greatly lower in comparison with a conventional print board, which suppresses expansion and deformation of the substrate. The conductive layers 2 and 4 comprise copper foils, and the insulating layer 3 comprises mixture of a glass cloth and epoxy resin or polyimide resin. |
