| 摘要 |
PROBLEM TO BE SOLVED: To prevent an organic resin filling body from separating from a conductive layer by forming the organic resin filling body for the conductive layer which is led to a lower face from the upper surface of an insulating board having the through hole through upper and lower main faces through the inner wall of the through hole and in the through hole with photo-curing resin. SOLUTION: The conductive layer 6 is deposited on the inner wall of the through hole 5 and the upper/lower faces of the insulating board 1. The conductive layer 6 comprises a metal with nickel as a main component. Since an area adhered to the inner wall of the through hole 5 in the conductive layer 6 is formed by the metal which is mainly composed of nickel whose junction with organic resin is satisfactory, junction intensity between the conductive layer 6 and the organic resin filling body 7 becomes strong when organic resin filling body is filled in the through hole 5. Then, the organic resin body 7 is prevented from separating from the conductive layer 6 even if external force is applied. The organic resin filling body 7 is constituted of photosensitive epoxy resin and photo-curing of the precursor is carried out in considerably short time compared to thermosetting resin. |
