发明名称 TRANSFER OF INSULATING FILM
摘要 PROBLEM TO BE SOLVED: To highly accurately transfer an insulating pattern in arbitrary film thickness by transferring the insulating resin layer on a transfer base plate formed by applying an insulating resin layer to the exposed conductive surface of a transfer plate to a receiving material. SOLUTION: A transfer plate connected to an external power supply 14 is inserted in an electrodeposition tank 10 housing an electrodeposition liquid 13 containing an ionic polymeric compd. P as an insulating electrodeposition resin so as to become polarity opposite to that of the compd. P and the opposed electrode plate 12 having opposite polarity connected to the external power supply 14 is arranged in opposed relation to the transfer plate 11. The transfer plate 11 is obtained by forming a mask part composed of an electric insulating material on the surface of a conductive base plate in a predetermined pattern. Subsequently, when a DC current is allowed to flow from the external power supply 14, the compd. P in the electrodeposition liquid 13 is electrically precipitated on the conductive part being the unmasked part on the surface of the transfer plate and formed as electrodeposition matter 3 to produce a transfer base plate. The insulating electrodeposition resin layer 3 formed on the transfer base plate is transferred to a receiving material.
申请公布号 JPH1024548(A) 申请公布日期 1998.01.27
申请号 JP19960196947 申请日期 1996.07.09
申请人 DAINIPPON PRINTING CO LTD 发明人 KAWAI KENZABURO;YOSHINUMA HIROTO
分类号 B41C1/06;C25D13/00;H05K3/46;(IPC1-7):B41C1/06 主分类号 B41C1/06
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