| 摘要 |
PROBLEM TO BE SOLVED: To prevent degradation of precision required as a wiring board due to wire breaks or deformation in circuits caused by void occurring during lamination by eliminating surface irregularity due to conductor circuits on a multilayer board. SOLUTION: A transferring sheet 1 on the surface of which conductor circuits 2 made of metals are formed, and semicured insulating layer 3 containing organic resins at least, are prepared previously, and next the conductor circuits 2 are transferred and buried in the insulating layer 3 by bonding the conductor circuits 2 formed in the transferring sheet 1 and the semicured insulating layer 3. Then a board 4 in the surface of whose insulating layer 3, the conductor circuits 2 are buried is obtained by removing the transferring sheet 1 from the insulating layer 3 in which the conductor circuits 2 are transferred and buried. Finally the multiple sheets 4 are laminated. |
