| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card, the lowering of the appearance of which due to the leaving of bubbles between layers at the lamination of resin plates is suppressed and the physical strength of which is improved. SOLUTION: The surface of a NON-contact IC module 6, which is produced by molding a semiconductor element and the like with resin, is roughened by being provided with fine unevenness having the average roughness of 1.5-2.5μm. In a blanked hole 5, which has the same phase as the non-contact IC module 6 and is bored on a core 2, the non-contact module 6 is filled. Under the state just mentioned above, the upper and lower sides of the core 2 are joiningly covered with over-sheets 3 and 4. |
