发明名称 SEMICONDUCTOR COMPONENT FIXING JIG
摘要 PROBLEM TO BE SOLVED: To improve the bonding strength and abrasion resistance of coating layers, to reduce the generation and adhesion of dusts and to make it possible to mass produce a semiconductor component of good quality at a high yield of manufacture by a method wherein the coating layers containing a chromium oxide as their main component are respectively formed on the surfaces of metal base materials. SOLUTION: A blasting treatment is previously performed and bottomed cylinder-shaped attracting plates 13b using a carbon steel for machine structure use, an alloy tool steel and a stainless steel as their metal base material are respectively prepared. A process for coating a chromic acid saturated aqueous solution on the side of the surface of each attracting plate 13b and a process for firing the plates 13b at a high temperature are repeated. In such a way, a coating layer 13a having a prescribed thickness is formed on the surface of each attracting plate 13b. Thereby, the bonding strength of the coating layer is high, the insulation properties and abrasion resistance of a fixing jig are good and dusts can be prevented from being produced and from adhering. Moreover, it becomes possible to mass produce a semiconductor component of good quality at a high yield of manufacture.
申请公布号 JPH1027811(A) 申请公布日期 1998.01.27
申请号 JP19960182183 申请日期 1996.07.11
申请人 TOSHIBA CORP 发明人 TAKENAMI YUKIHIRO;YABE HISAO
分类号 H01L21/60;H01L21/52 主分类号 H01L21/60
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