发明名称 BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a bonding device, which can prevent a bonding tool from being broken by the descent of the tool at a turn-off time of a power supply and at the time of non-current conduction, such as service interruption, and is stable in bondability and can reduce an irregularity in a loop shape. SOLUTION: A bonding device is constituted into such a structure that the device is provided with a swinging arm 1 having a bonding tool 2 on the point, a support material 5 having an axis 3 of rotation for supporting in such a way as to freely slide this swinging arm 1 and a motor which drives the arm 1, the arm 1 is provided with an electromagnet 21 and at the time of current conduction, a balancer 24 is magnetically sucked to the electromagnet 21 to keep the balance of the arm 1 and at the time of non-current conduction, the magnetic suction of the balancer 24 is released and the balancer 24 descends and the point side of the arm 1 is leapt up.
申请公布号 JPH1027817(A) 申请公布日期 1998.01.27
申请号 JP19960183346 申请日期 1996.07.12
申请人 TOSHIBA CORP 发明人 SATO TSUYOSHI;OTANI KAZUMI
分类号 H01L21/60 主分类号 H01L21/60
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