| 摘要 |
PROBLEM TO BE SOLVED: To enable an IC to be promptly and accurately positioned with a simple structure by allowing a chucking pad to chuck the IC and by making L-shaped guide members which face each other and are symmetrically arranged proximate to each other come into contact with a mold package part. SOLUTION: An IC body 4 has a plane rectangle shape and a mold package part 3 is formed in the center of the IC body 4. The mold package part 3 made of a resin protects various devices formed on the IC body 4. In the case of positioning the IC, a chucking pad 5 of a hollow cylinder chucks and holds the mold package part 3 of an IC 2 with one of the faces. Further, guide members 7a and 7b, each having an L-letter shape, which face each other and the proximate are arranged symmetrically on both sides of the chucking pad 5. The IC 2 is chucked by the adsorption pad 5 and the guide members 7a and 7b are allowed to come into contact with the mold package part 3. |
