| 摘要 |
PROBLEM TO BE SOLVED: To provide a production method for multilayer wiring board excellent in workability in which a thin inner layer plate can be aligned accurately and an outer layer copper foil is prevented from being creased by an eyelet. SOLUTION: A multilayer wiring board is produced by laminating a plurality of inner layer plates 4 formed with wiring patterns on the opposite sides while sandwiching prepregs 5a, applying prepregs 5b and outer layer metal foils 6 to the opposite sides of the laminate and then integrally molding by hot press. In this regard, reference holes are made through the inner layer plates 4 and the prepregs 5a at predetermined positions thereof and tubular eyelets 7 of 0.2mm thick or less and 3.0mm high or less are driven into the reference holes and caulked thus integrating the inner layer plates 4 and the prepregs 5a. Subsequently, it is applied with the prepregs 5b and the outer layer metal foils 6 on the opposite sides and integrally molded by hot press. |
