发明名称 |
MANUFACTURE OF PLASTIC FLOW SHEET FOR MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE OF MULTILAYER WIRING BOARD USING THE SHEET |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a plastic flow sheet excellent in mold releasing property by preventing the ooze of an insulating adhesive into the hole to serve as an IVH used for the manufacture of a multilayer printed wiring board having an IVH (interstitial via hole). SOLUTION: In this sheet, a crosslinked resin layer 0.1-10μm thick is provided on at least one face of a sheet which plastically flows such as polyethylene or the like. It is to be desired that the tensile elastic modulus of such crosslinked resin layer should be 3×10<3> MPa or under at 25-100 deg.C and 3×10<2> MPa or under at 100-180 deg.C. This manufacture is one which opens a through hole in a metallic foil fitted with an adhesive where a half hardened insulating adhesive is provided on one side of a metallic foil or the insulating layer face of a laminate with its one side lined with a metallic foil, and lays the adhesive face on a circuit board prepared in advance, and lays the above-mentioned plastic flow sheet for a multilayer-wiring board which plastically flows on the metallic foil in the stacking process, and stacks and unites them by heating and pressing.</p> |
申请公布号 |
JPH1022639(A) |
申请公布日期 |
1998.01.23 |
申请号 |
JP19960170799 |
申请日期 |
1996.07.01 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
INADA TEIICHI;NAKASO AKISHI;TSURU YOSHIYUKI;YAMAMOTO KAZUNORI;TAKAHASHI ATSUSHI;MADARAME TAKESHI;OTSUKA KAZUHISA;ARIGA SHIGEHARU |
分类号 |
B32B15/08;B32B27/32;B32B27/38;B32B37/10;H05K3/46;(IPC1-7):H05K3/46;B32B31/20 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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