| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for bonding a work with bumps to another work through an anisotropic conductive tape or film (ACF), which can avoid generation of any voids on the ACF. SOLUTION: Hot air is blown toward a lower surface of an ACF 5 to sufficiently soften and fluidize the lower surface, after which the ACF 5 is bonded onto a board 1. Next a bumped chip 3 is secured to a bonding tool 17 and then positioned above the board 1. At this time hot air is blown from a hot air nozzle 14 to heat the upper surface of the ACF 5 and the lower surface of the bumped chip 3. Next, the hot air nozzle is retreated, the bumped chip 3 is pushed against the ACF 5 for bonding. In this case, since the upper surface of the ACF 5 is heated, softened and fluidized, the ACF 5 can snugly fit to the lower surface of the bumped chip 3, whereby no void can be generated between the ACF 5 and the lower surface of the chip 3.</p> |
