| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is appropriately flattened by detecting a surface state when the surface of a semiconductor device is flattened by chemical or mechanical polishing to appropriately judge a polishing ending point. SOLUTION: A reference glass 101 which is provided with a λ/4 plate is opposedly arranged on the surface of a substrate so that the λ/4 plate is positioned on the side of the surface of the substrate. The surface of the substrate is irradiated with light flux from a light source with the reference glass and the λ/4 plate in between. By utilizing an interference signal which is obtained when a reference beam, reflected on the reference surface of the reference glass 101, and an object beam, reflected on the surface of the substrate, interfere with each other with an interferometer, a surface form of the substrate is measured. |
