发明名称 |
CLEANING MEMBER AND CLEANING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To realize easy cleaning by forming an adhesive film having specific viscosity on a semiconductor a semiconductor wafer thereby removing dust efficiently without causing any damage at the forward end part of a probe pin at all. SOLUTION: The cleaning member has such surface shape as touching the line or surface defined by the forward end part of a semiconductor measuring probe simultaneously and generally has a planar shape. An adhesive of various forms is employed as an adhesive substance and an acryl based adhesive is preferably employed in order to avoid so-called residual paste. Dust is left easily when the viscosity (JISZ0237) of an adhesive substance is lower than 100g/25mm, and a paste is left easily on the surface of the semiconductor measuring probe when it exceeds 250g/25mm and thereby the viscosity is preferably set in the range 120g/25mm-200g/25mm. Thickness of the adhesive substance is preferably set in such range as the forward part of a pin is inserted sufficiently without leaving any paste and it is generally set in the range of 10-50μm.
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申请公布号 |
JPH1019928(A) |
申请公布日期 |
1998.01.23 |
申请号 |
JP19960173721 |
申请日期 |
1996.07.03 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
TAKANO MINORU;NAKASAKI NORIAKI;KATO KAZUO |
分类号 |
G01R1/06;G01R31/28;H01L21/304;H01L21/66;(IPC1-7):G01R1/06 |
主分类号 |
G01R1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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