| 摘要 |
PROBLEM TO BE SOLVED: To enable formation of a uniform and thick insulating adhesive material for fixing a semiconductor chip, by making the lead width of an inner lead coated with an insulating adhesive material to be equal to or smaller than the lead spacing. SOLUTION: When the lead width is greater than the lead spacing, the state of an adhesive material is such that it is applied on the surface of a plate-like member having little spacing. The applied adhesive material is likely to expand and the film thickness is reduced. Therefore, the lead spacing s which is the pitch at a portion of an inner lead 1 coated with an insulating adhesive material for fixing a semiconductor chip, and the lead width w, are set to be at a ratio of s:w=1:1 or less. That is, the lead width w is made smaller than the lead spacing s. Thus, a layer of the insulating adhesive material may be formed uniformly with a large thickness on the inner lead 1, thereby enabling stable fixing and wire bonding of the semiconductor chip. |
