| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity of wire bonding and enable wire bonding without failure wire bonding, even when a lead frame is in an acceptable level but has an curved inner lead. SOLUTION: When a chip mounted on a chip mounting part 7 of a lead frame 2 is connected with tip parts of inner leads which are plurally formed on the periphery of the chip through wires, position coordinates of the tip parts of the inner leads are detected with a camera 1 for lead position detection before carriage to a bonding stage 5, and the position coordinate signal is inputted and stored in a control equipment 10. After that, when the lead frame 2 is carried to the bonding stage 5 and wire bonding is performed, only the chip position is detected with a camera 9, the detected signal is inputted in the control equipment 10, and bonding is performed with a wire bonder 6 on the basis of the detecting signal and the lead position coordinate signal. |
