| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor filling method to a via hole which can charge conductor paste precisely into via holes with very small bores and at narrow pitches. SOLUTION: Since the expected conductor filling is performed by heating, fusing, and evaporating conductor paste by the application of a laser beam L and allowing those fused evaporated particles Pa to enter a via hole 2 to stick thereto, a high-density wiring board can be made easily by performing the conductor charge into a via hole 2 precisely even in the case that the inside diameter of the via hole 2 made through a board 1 is micronized and that the formation pitch is small. |
