| 摘要 |
PROBLEM TO BE SOLVED: To enable test of high precision at a high speed when test circumstance is deteriorated by increasing the length of a lead on a TAB tape in multipin structure. SOLUTION: Device halls 3a, 3b are opened in a resin tape 2, test pads 5 are arranged on the tape 2, and a wiring pattern 4 whose tip part is made an inner lead is formed. A semiconductor circuit chip 1a as a main chip is mounted on a device hole 3a, and an integrated circuit chip 1b for waveform shaping is mounted on a device hole 3b. A signal of an LSI tester is shaped by the integrated circuit 1b for waveform shaping, and test is performed by supplying a double phase clock wherein waveform deterioration and phase deviation are eliminated. |
