| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of processes and maintain flatness of an adhesive agent surface for an additive method, by a method in which an adhesive agent layer is formed on one side of a metal foil, a resin sheet is stacked on a circuit pattern side which is formed by working the metal foil, a unified body is obtained by heating and pressing, and a circuit pattern is formed on the adhesive agent layer surface by nonelectrolytic plating. SOLUTION: Adhesive agent varnish is spread on one side of an electrolytic copper foil 1 and heated, and a copper foil with an adhesive agent layer is manufactured. Etching resist is laminated on the copper foil surface side, stoving, developing, etching and resist peeling are perfomed, and a circuit pattern 3 is formed. Four resin sheet using epoxy prepreg are so stacked that circuit pattern surfaces are in contact with both of the sides, and heating and pressing are performed. A hole 6 for a through hole is formed in the laminated body, plating resist is laminated, an adhesive agent layer surface is roughened after stoving and developing, and copper is deposited on a specified part and the inner wall of the through hole 6 by impregnating the laminated body with nonelectrolytic plating liquid. Thereby the number of manufacturing processes is reduced, and flatness of the adhesive agent surface for an additive method can be maintained. |
