| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of burr at an electrically connecting part after a semiconductor element is integrally molded with a box type hollow resin molding package and improve electrical connection with the semiconductor element by providing protruding parts on the three sides at the leading edge part. SOLUTION: When the leading edge of the protruding parts 3 provided on the three sides of an inner lead part 2, which is the flat part at the leading edge of a lead frame 1, is brought into contact with the metal die face 5 of a box type hollow resin molding die 4, elasticity in a direction that makes the leading edge of the protruding part 3 adhere to the metal die face 5 is generated in the lead frame 1 due to curve, and the protruding part 3 is brought into linear contact with the metal die face 5. Thus, sealing performance of the contact part between the leading edge of the protruding part 3 and the bottom face of the groove is high, an when resin is injected to a space 6 under such condition, generation of burr is prevented at the electrically connecting part of an inner lead part 2, since the resin does not invade the inner lead part 2 from the contact part. |
