| 摘要 |
PROBLEM TO BE SOLVED: To restrain the influence of injection pressure of a mold resin, prevent a short-circuit of adjacent inner leads, and realize improvement in reliability, by narrowing the spacing between the inner leads and a semiconductor chip mounting region as it becomes away from a region where the mold resin is injected. SOLUTION: A lead frame 2 is formed by press-molding 42 alloys. The spacing between inner leads 21, 22, 23,... and a semiconductor chip mounting portion 1 is narrowed, and inner lead widths d1, d2,... and adjacent inner lead spacings 11, 12,... are narrowed, as it becomes away from an injection port for a mold resin. Thus, increase in the quantity of use of an expensive bonding wire may be restrained as much as possible while the mechanical, strength of the inner leads 21, 22, 23,... is ensured. Also, even when the inner leads are pressed by the injection pressure of the mold resin, the adjacent inner leads do not contact each other. |
