发明名称 ELECTRONIC PARTS MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To accurately position electronic parts by preventing the falling down and breakage of the parts by taking the whole image of the parts and processing the image, and then, mounting the parts on a substrate by correcting the relative position between the parts and substrate. SOLUTION: A substrate is set on the substrate holding tool on an X-Y table C. Electronic parts are wound around a reel 3 and carried to a position immediately below a suction head 54 by means of a tape carrier. The head 54 ascends after sticking the parts by suction. Then the head 54 is intermittently rotated by means of an index unit 12 and sent to a visually recognizing section E. The section F detects the positional deviation between the parts and the head 54 by means of a camera and transmits the data about the positional deviation to a controller. The controller positions the table C so that the position to be mounted with the parts on the substrate can come to a prescribed position by taking the data about the positional deviation into consideration. Then the suction head 54 carries the parts to a position immediately above the substrate and descends so as to mount the parts on the substrate.
申请公布号 JPH1022696(A) 申请公布日期 1998.01.23
申请号 JP19970068400 申请日期 1997.03.21
申请人 HITACHI LTD 发明人 FUJITA YASUHIRO;SUZUKI TAKAMICHI;KAWANA TAKESHI
分类号 B23P19/00;H05K13/04;H05K13/08 主分类号 B23P19/00
代理机构 代理人
主权项
地址