SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To facilitate handling in production process by forming a conductor layer on a resin layer having bumps for external connection electrodes and connecting them to exposed connecting members on the resin layer. SOLUTION: Electrode pads 12 to be electrodes are formed on the lower face of a semiconductor chip 11 and bumps 13 to be connecting members are formed on the pads 12. A resin layer 14 is formed on the chip lower face with leaving the bumps 13 partly exposed. The resin layer 14 has bumps 14a and conductor layer 15 on the resin layer 14 including the bumps 14a to electrically connect the conductor layer 15 to the exposed bumps 13 on the resin layer 14. A solder resist layer 16 is partly formed esp. on other areas on the layer 15 than the bumps 14a. This facilitates handing in the condition of semiconductor wafers.