发明名称 |
LOW APPLICATION TEMPERATURE HOT MELT WITH EXCELLENT HEAT AND COLD RESISTANCE |
摘要 |
A hot melt useful for packaging comprising: a) from about 10 % to about 40 % by weight of a block copolymer; b) up to about 20 % of a compatible polymer wherein the total polymer content does not exceed 40 % by weight; c) from about 25 % to about 60 % by weight of at least one tackifying resin; d) from about 5 % to about 25 % by weight of a compatible plasticizer; and e) from about 10 % to about 40 % by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150 ~C.
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申请公布号 |
CA2255793(A1) |
申请公布日期 |
1998.01.22 |
申请号 |
CA19972255793 |
申请日期 |
1997.07.14 |
申请人 |
H.B. FULLER LICENSING & FINANCING, INC. |
发明人 |
KUEPPERS, MICHELLE C. |
分类号 |
C09J153/00;(IPC1-7):C09J153/00;B65D33/18;C09J191/06;B65B51/02 |
主分类号 |
C09J153/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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