FILM-LIKE ADHESIVE FOR CONNECTING CIRCUIT AND CIRCUIT BOARD

摘要

A heat-activable adhesive for connecting circuit which is used for electrically connecting circuit electrodes facing to each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40 DEG C after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a potential curing agent. An acrylic rubber having a glycidyl ether group in a molecule is preferably used as the acrylic rubber.