发明名称 METALLIZED MULTILAYER PACKAGING FILM
摘要 <p>A metallized multilayer film comprising a film substrate having in cross section: a) a core layer comprising a film-forming base polymer, e.g., an isotactic polypropylene homopolymer, optionally blended with a maleic anhydride-modified polyolefin, e.g., polypropylene; b) if said maleic anhydride-modified polyolefin is not blended with said base polymer, an adhesion-promoting tie layer of a maleic anhydride-modified polyolefin on one surface of the core layer; c) a metal receiving skin layer of an ethylene vinyl alcohol copolymer (EVOH) on a surface either of the core layer containing such blended maleic anhydride-modified polyolefin, or that of said maleic anhydride-modified polyolefin tie layer; d) optionally, on the other side of the core layer, a polymer skin layer having a lower melting temperature than that of said core layer, e.g., a copolymer of propylene, ethylene, and optionally butene-1; the film substrate containing a metal deposit, e.g., aluminum, on the EVOH copolymer surface, and a polymeric low temperature sealable coating (LTSC) comprising a copolymer of 10 to 35 wt.% of at least one α,β-ethylenically unsaturated carboxylic acid with 65 to 90 wt.% of ethylene, an alkyl acrylate or methacrylate, acrylonitrile, or mixtures thereof, on the surface of said metal deposit. The film has excellent mechanical and barrier properties and can be used to overwrap food and non-food products such that the package has a protected metal coating and superior seal strength.</p>
申请公布号 WO1998002305(A1) 申请公布日期 1998.01.22
申请号 US1997012161 申请日期 1997.07.11
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