| 摘要 |
Mold equipment suitable for automated operation provides for encapsulation molding of circuit devices arranged in spaced relationship lengthwise of a carrier strip (28). The equipment comprises a loading station (30, 34) for loading carrier strips (28) onto a movable carrier strip support plate (26) having spaced apart cavities (26a) which receive the circuit devices for encapsulation. The apparatus further includes a remotely located molding station (10) and apparatus (38-44) for transfer of loaded carrier strip support plates to the molding station (10). Gates (60) formed in the carrier strip support plate (26) are provided for delivery of encapsulating resin to the cavities (26a) when the support plate (26) is at the molding station (10). Pick and place apparatus (39, 42, 50) at the loading station remove the carrier strips (28) with encapsulated devices from the support plates (26) and replace them with carrier strips having circuits for encapsulation.
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